| | Mechanics of Solids A Journal of Russian Academy of Sciences | | Founded
in January 1966
Issued 6 times a year
Print ISSN 0025-6544 Online ISSN 1934-7936 |
Archive of Issues
Total articles in the database: | | 12804 |
In Russian (Èçâ. ÐÀÍ. ÌÒÒ): | | 8044
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In English (Mech. Solids): | | 4760 |
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<< Previous article | Volume 55, Issue 5 / 2020 | Next article >> |
N.A. Verezub and A.I. Prostomolotov, "Mechanics of Growing and Heat Treatment Processes of Monocrystalline Silicon," Mech. Solids. 55 (5), 643-653 (2020) |
Year |
2020 |
Volume |
55 |
Number |
5 |
Pages |
643-653 |
DOI |
10.3103/S0025654420300056 |
Title |
Mechanics of Growing and Heat Treatment Processes of Monocrystalline Silicon |
Author(s) |
N.A. Verezub (Ishlinsky Institute for Problems in Mechanics, RAS, Moscow, 119526 Russia, verezub@ipmnet.ru)
A.I. Prostomolotov (Ishlinsky Institute for Problems in Mechanics, RAS, Moscow, 119526 Russia, prosto@ipmnet.ru) |
Abstract |
One of the urgent problems of mechanics is the study of the regularities of thermomechanical processes that affect the formation of microdefects in dislocation-free silicon single crystals both at the stage of their growth from the melt by the main industrial technology called the Czochralski method, and in subsequent heat treatment technologies of the wafers cut from them. This requires the development of coupled thermomechanical models both for the melt-crystal system, taking into account the crystallization process, and for the entire volume of the thermal unit of industrial growth plants, so that, taking into account the calculated “thermal history” of growing a particular silicon single crystal using modern models of defect formation, determine the regularities of the recombination and transfer processes. intrinsic point defects with their agglomeration into microdefects in monocrystalline silicon. This article provides a brief overview of the work carried out at IPMech RAS in this direction. |
Keywords |
single crystal growth, silicon, Czochralski method, intrinsic point defect, recombination, microdefect, diffusion, modeling, stress, deformation, heat treatment, plate |
Received |
21 January 2020 | Revised |
19 February 2020 | Accepted |
04 April 2020 |
Link to Fulltext |
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