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IssuesArchive of Issues2025-7pp.5856-5870

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Yue Hong, Jie Yang, Fenghua Cao, and Mingliang Yu, "Investigation on Anti-Plane Dynamic Stress Characteristics of a Nanoscale Hole in Circular Laminated Structures," Mech. Solids. 60 (7), 5856-5870 (2025)
Year 2025 Volume 60 Number 7 Pages 5856-5870
DOI 10.1134/S0025654425604276
Title Investigation on Anti-Plane Dynamic Stress Characteristics of a Nanoscale Hole in Circular Laminated Structures
Author(s) Yue Hong (School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 201306 China)
Jie Yang (School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 201306 China, yangj@sdju.edu.cn)
Fenghua Cao (School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 201306 China)
Mingliang Yu (Zhejiang Lianda Forging Co., Ltd., Wenzhou, 325207 China)
Abstract The present paper focuses on the dynamic stress response characteristics of nano-scale circular hole defects embedded in biphasic circular laminated structures. A theoretical analytical model for the interface of a biphasic medium with hole defects has been developed using the complex function method, combined with the Helmholtz control equation and wavefield superposition theory. Firstly, expressions for wavefield functions in isotropic media are presented. Subsequently, nano-scale surface/interface effects are introduced to construct an infinite linear system of equations that simultaneously satisfy the continuity conditions of interfacial stress and displacement, as well as the free boundary conditions of circular hole stresses. The analytical solution is obtained by truncating the system of equations to a finite number of terms, which is then analysed through specific examples. The analytical results indicate that the nano-surface/interface factor exerts an inhibitory effect on the dynamic stress concentration around the hole. Furthermore, particular attention should be paid to the amplitude distribution of the dynamic stress concentration factor (DSCF) under the condition of a low wave number ratio, as stress concentration is more likely to be induced when the modulus ratio is low. The software is capable of accurately simulating the formation and evolution of various defects, such as cracks and holes. Furthermore, it has been demonstrated to be capable of predicting the effects of these defects on the mechanical and physical properties of materials with a high degree of efficiency. This approach establishes the foundation for defect detection, life assessment, and optimal design.
Keywords complex variable function, superposition theory, laminated structure, nanohole, nanoscale surface/interface effect
Received 06 August 2025Revised 29 September 2025Accepted 14 October 2025
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