 | | Mechanics of Solids
A Journal of Russian Academy of Sciences | | Founded
in January 1966
Issued 6 times a year
Print ISSN 0025-6544
Online ISSN 1934-7936 |
Archive of Issues
| Total articles in the database: | | 13205 |
| In Russian (Èçâ. ÐÀÍ. ÌÒÒ): | | 8140
|
| In English (Mech. Solids): | | 5065 |
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| N.A. Djuzhev, E.E. Gusev, M.Y. Fomichev, P.S. Ivanin, I.V. Kushnarev, and V.A. Bespalov, "Multifunctional Shuttle for Processing Small Diameter and Ultra-Thin Semiconductor Wafers," Mech. Solids. 60 (2), 839-847 (2025) |
| Year |
2025 |
Volume |
60 |
Number |
2 |
Pages |
839-847 |
| DOI |
10.1134/S0025654424605226 |
| Title |
Multifunctional Shuttle for Processing Small Diameter and Ultra-Thin Semiconductor Wafers |
| Author(s) |
N.A. Djuzhev (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia)
E.E. Gusev (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia, bubbledouble@mail.ru)
M.Y. Fomichev (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia)
P.S. Ivanin (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia)
I.V. Kushnarev (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia)
V.A. Bespalov (National Research University of Electronic Technology (MIET), Zelenograd, Moscow, 124498 Russia) |
| Abstract |
In a first for Russia, a 100 mm diameter wafer was processed to create holes for TSV structures using automated equipment designed for 150 mm diameter wafers without needing to reconfigure the installations. A shuttle wafer was developed for this purpose. The reliability of the silicon shuttle was determined through experimental studies of the mechanical strength of silicon. The thickness of the ultra-thin Si wafer that can be processed without damage in the shuttle wafer on installations with a vacuum table was calculated based on the data obtained. |
| Keywords |
microassembly, 3D integration, TSV, surface relief, photolithography, DRIE, temporary bonding |
| Received |
02 September 2024 | Revised |
03 October 2024 | Accepted |
05 October 2024 |
| Link to Fulltext |
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