 | | Mechanics of Solids
A Journal of Russian Academy of Sciences | | Founded
in January 1966
Issued 6 times a year
Print ISSN 0025-6544
Online ISSN 1934-7936 |
Archive of Issues
| Total articles in the database: | | 13205 |
| In Russian (Èçâ. ÐÀÍ. ÌÒÒ): | | 8140
|
| In English (Mech. Solids): | | 5065 |
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| << Previous article | Volume 60, Issue 2 / 2025 | Next article >> |
| Qingqing Shen, Lvlin Xiang, Qiyun Wang, Jiajun Zeng, Wei Yi, Dianyi Huang, and Jinshan Lei, "A Semi-Analytic Method for Computing Cross-Crack Stress Intensity Factor in Finite Plate under Thermal-Mechanical Coupling," Mech. Solids. 60 (2), 973-988 (2025) |
| Year |
2025 |
Volume |
60 |
Number |
2 |
Pages |
973-988 |
| DOI |
10.1134/S002565442460572X |
| Title |
A Semi-Analytic Method for Computing Cross-Crack Stress Intensity Factor in Finite Plate under Thermal-Mechanical Coupling |
| Author(s) |
Qingqing Shen (Hunan Institute of Technology, Hengyang, 421002 China)
Lvlin Xiang (Hunan Institute of Technology, Hengyang, 421002 China, lvlin2008.cool@163.com)
Qiyun Wang (Hunan Institute of Technology, Hengyang, 421002 China)
Jiajun Zeng (Hunan Institute of Technology, Hengyang, 421002 China)
Wei Yi (Central South University, Changsha, 410075 China, yi.wei@csu.edu.cn)
Dianyi Huang (Central South University, Changsha, 410075 China)
Jinshan Lei (Hunan Tieyuan Civil Engineering Testing Co., Ltd, Changsha, 410075 China) |
| Abstract |
Currently, most of the available methods are focused on the SIF calculation of single cross-crack under single stress loading, without consideration of the thermal-mechanical coupling loadings. To capture the true coupling impact of the temperature and stress fields, based on the Williams expansion and semi-weight function method, a semi-analytic method is presented to calculate the thermal-mechanical coupling cross-crack SIF under arbitrary boundary conditions. The existing results are used to validate the method and several examples are given to analyze the influence of crack length, temperature and boundary on the cross-crack SIF under thermal-mechanical coupling. Results show that when L/a (the ratio of the rectangle length to the crack half-length) and H/a (the ratio of the rectangle width to the crack half-length) increase, Mode I fracture is more likely to occur. The increase of plate size only changes the SIFs, but not the stress distribution of coupling field. The effect of circular boundary on crack tip stress field is greater than that of rectangular boundary. |
| Keywords |
cross-crack, thermal-mechanical coupling, stress intensity factor, semi-weight function method |
| Received |
12 October 2024 | Revised |
14 February 2025 | Accepted |
15 February 2025 |
| Link to Fulltext |
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